Modular mass storage system

ABSTRACT

A system for storing data includes a rack, one or more data storage modules coupled to the rack, and one or more data control modules coupled to the rack. The data storage modules may include a chassis, two or more backplanes coupled to the chassis, and one or more mass storage devices (for example, hard disk drives) coupled to the backplanes. The data control modules may access the mass storage devices in the data storage modules.

This application is a divisional of U.S. patent application Ser. No.15/231,618, filed Aug. 8, 2016, now U.S. Pat. No. 9,785,600, which is acontinuation of U.S. patent application Ser. No. 14/292,528, filed May30, 2014, now U.S. Pat. No. 9,411,525, which is a continuation of U.S.patent application Ser. No. 13/069,065, filed Mar. 22, 2011, now U.S.Pat. No. 8,743,549, both of which are incorporated herein in theirentirety.

BACKGROUND

Organizations such as on-line retailers, Internet service providers,search providers, financial institutions, universities, and othercomputing-intensive organizations often conduct computer operations fromlarge scale computing facilities. Such computing facilities house andaccommodate a large amount of server, network, and computer equipment toprocess, store, and exchange data as needed to carried out anorganization's operations. Typically, a computer room of a computingfacility includes many server racks. Each server rack, in turn, includesmany servers and associated computer equipment.

Computer systems typically include a number of components that generatewaste heat. Such components include printed circuit boards, mass storagedevices, power supplies, and processors. For example, some computerswith multiple processors may generate 250 watts of waste heat. Someknown computer systems include a plurality of such larger,multiple-processor computers that are configured into rack-mountedcomponents, and then are subsequently positioned within a rack system.Some known rack systems include 40 such rack-mounted components and suchrack systems will therefore generate as much as 10 kilowatts of wasteheat. Moreover, some known data centers include a plurality of such racksystems.

Some servers include a number of hard disk drives (for example, eight ormore hard disk drives) to provide adequate data storage. Typically, thehard disk drives for servers are of a standard, off-the-shelf type.Standard, off-the-shelf hard disk drives are often a cost effectivesolution for storage needs because such hard disk drives can be obtainedat relatively low cost. Nonetheless, in server designs using suchstandard hard disk drives, the arrangement of the hard disk drives mayleave a substantial amount of wasted space in the server chassis. Thiswasted space, especially when multiplied over many servers in a rack,may result in inadequate computing or storage capacity for a system.

Hard disk drives include motors and electronic components that generateheat. Some or all of this heat must be removed from the hard disk drivesto maintain continuous operation of a server. The amount of heatgenerated by the hard disk drives within a data room may be substantial,especially if all of the hard disk drives are fully powered up at alltimes.

As with other components, hard disk drives fail from time to time whilein service. These failures reduce the storage capacity of a system. Torestore capacity, servers may need to be powered down and removed from arack so that the defective hard disk drives can be replaced or repaired.

In some systems, such as archival, backup, or disaster recovery systems,a vast amount of may need to be stored, though any particular piece ofthe stored data may be accessed only rarely. Magnetic tape systems areoften used to store archival data. Magnetic tape drives, however, may befragile and susceptible to adverse environmental conditions, such asheat and humidity. In addition, some magnetic tape drives haverelatively high failure rates.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating one embodiment of a systemincluding a data control module and data storage modules in a rack.

FIG. 2 illustrates one embodiment of a system including a data controlmodule and data storage module having mass storage devices installed onmultiple backplanes.

FIG. 3 is a schematic diagram illustrating a front view of three datastorage subsystems in a rack.

FIG. 4 illustrates one embodiment of disk drive backplanes mounted onpads in a chassis.

FIG. 5 illustrates one embodiment of venting of airflow from under massstorage device backplanes.

FIG. 6 illustrates one embodiment of a data storage module including ashelf and cross braces for hard disk drives with hard disk drivesinstalled on the shelf.

FIG. 7 illustrates one embodiment of a data storage module including ashelf and cross braces for hard disk drives with hard disk drivesremoved.

FIG. 8 is a top perspective view of one embodiment of a hard disk driveassembly including a backplane circuit board.

FIG. 9 is a bottom perspective view of one embodiment of a hard diskdrive assembly including a backplane circuit board.

FIG. 10 is illustrates one embodiment of an installation of hard diskdrives in a data storage module.

FIG. 11 illustrates one embodiment of a module that includes a datacontroller and multiple disk drive backplanes.

FIG. 12 illustrates one embodiment of removal of heat from data storagemodules in a rack system.

FIG. 13 illustrates a method of providing data storage that includesproviding mass storage devices on two or more backplanes coupled to acommon chassis.

While the invention is susceptible to various modifications andalternative forms, specific embodiments thereof are shown by way ofexample in the drawings and will herein be described in detail. Itshould be understood, however, that the drawings and detaileddescription thereto are not intended to limit the invention to theparticular form disclosed, but on the contrary, the intention is tocover all modifications, equivalents and alternatives falling within thespirit and scope of the present invention as defined by the appendedclaims. The headings used herein are for organizational purposes onlyand are not meant to be used to limit the scope of the description orthe claims. As used throughout this application, the word “may” is usedin a permissive sense (i.e., meaning having the potential to), ratherthan the mandatory sense (i.e., meaning must). Similarly, the words“include,” “including,” and “includes” mean including, but not limitedto.

DETAILED DESCRIPTION OF EMBODIMENTS

Various embodiments of computer systems, and systems and methods forperforming computing operations, are disclosed. According to oneembodiment, a system for storing data includes a rack, one or more datastorage modules coupled to the rack, and one or more data controlmodules coupled to the rack. The data storage modules may include achassis, two or more backplanes coupled to the chassis, and one or moremass storage devices (for example, hard disk drives) coupled to thebackplanes. The data control modules may access the mass storage devicesin the data storage modules.

According to one embodiment, a data storage module includes a chassis,two or more backplanes coupled to the chassis in a primarily horizontalorientation, and two or more hard disk drives coupled to each of thebackplanes.

According to one embodiment, a data storage module includes a chassis,one or more backplanes coupled to the chassis in a primarily horizontalorientation, two or more mass storage devices coupled to each of thebackplanes, and one or more air passages under the backplanes. The airpassages include an air inlet and an air outlet. The air passage allowsair to move from the air inlet to the air outlet to remove heat from atleast one of the mass storage devices.

According to one embodiment, a method of providing data storage includesproviding mass storage devices on two or more backplanes coupled to acommon chassis. Some of the mass storage devices are powered down orplaced on standby. When the data on one of the mass storage devicesneeds to be accessed, the mass storage device is powered up or awakenedfrom standby.

As used herein, “air handling system” means a system that provides ormoves air to, or removes air from, one or more systems or components.

As used herein, “air moving device” includes any device, element,system, or combination thereof that can move air. Examples of air movingdevices include fans, blowers, and compressed air systems.

As used herein, an “aisle” means a space next to one or more elements,devices, or racks.

As used herein, “backplane” means a plate or board to which otherelectronic components, such as mass storage devices, circuit boards, canbe mounted. In some embodiments, hard disk drives are plugged into abackplane in a generally perpendicular orientation relative to the faceof the backplane. In some embodiments, a backplane includes and one ormore power buses that can transmit power to components on the backplane,and one or more data buses that can transmit data to and from componentsinstalled on the backplane.

As used herein, “ambient” means, with respect to a system or facility,the air surrounding at least a portion of the system or facility. Forexample, with respect to a data center, ambient air may be air outsidethe data center, for example, at or near an intake hood of an airhandling system for the data center.

As used herein, a “cable” includes any cable, conduit, or line thatcarries one or more conductors and that is flexible over at least aportion of its length. A cable may include a connector portion, such asa plug, at one or more of its ends.

As used herein, “circuit board” means any board or plate that has one ormore electrical conductors transmitting power, data, or signals fromcomponents on or coupled to the circuit board to other components on theboard or to external components. In certain embodiments, a circuit boardis an epoxy glass board with one or more conductive layers therein. Acircuit board may, however, be made of any suitable combination ofmaterials.

As used herein, “chassis” means a structure or element that supportsanother element or to which other elements can be mounted. A chassis mayhave any shape or construction, including a frame, a sheet, a plate, abox, a channel, or a combination thereof. In one embodiment, a chassisis made from one or more sheet metal parts. A chassis for a computersystem may support circuit board assemblies, power supply units, datastorage devices, fans, cables, and other components of the computersystem.

As used herein, “computing” includes any operations that can beperformed by a computer, such as computation, data storage, dataretrieval, or communications.

As used herein, “computer system” includes any of various computersystems or components thereof. One example of a computer system is arack-mounted server. As used herein, the term computer is not limited tojust those integrated circuits referred to in the art as a computer, butbroadly refers to a processor, a server, a microcontroller, amicrocomputer, a programmable logic controller (PLC), an applicationspecific integrated circuit, and other programmable circuits, and theseterms are used interchangeably herein. In the various embodiments,memory may include, but is not limited to, a computer-readable medium,such as a random access memory (RAM). Alternatively, a compact disc-readonly memory (CD-ROM), a magneto-optical disk (MOD), and/or a digitalversatile disc (DVD) may also be used. Also, additional input channelsmay include computer peripherals associated with an operator interfacesuch as a mouse and a keyboard. Alternatively, other computerperipherals may also be used that may include, for example, a scanner.Furthermore, in the some embodiments, additional output channels mayinclude an operator interface monitor and/or a printer.

As used herein, “data center” includes any facility or portion of afacility in which computer operations are carried out. A data center mayinclude servers dedicated to specific functions or serving multiplefunctions. Examples of computer operations include informationprocessing, communications, testing, simulations, power distribution andcontrol, and operational control.

As used herein, “data center module” means a module that includes, or issuitable for housing and/or physically supporting, one or more computersystems that can provide computing resources for a data center.

As used herein, to “direct” air includes directing or channeling air,such as to a region or point in space. In various embodiments, airmovement for directing air may be induced by creating a high pressureregion, a low pressure region, or a combination both. For example, airmay be directed downwardly within a chassis by creating a low pressureregion at the bottom of the chassis. In some embodiments, air isdirected using vanes, panels, plates, baffles, pipes or other structuralelements.

As used herein, “member” includes a single element or a combination oftwo or more elements (for example, a member can include two or moresheet metal parts fastened to one another.

As used herein, a “module” is a component or a combination of componentsphysically coupled to one another. A module may include functionalelements and systems, such as computer systems, circuit boards, racks,blowers, ducts, and power distribution units, as well as structuralelements, such a base, frame, housing, or container.

As used herein, “primarily horizontal” means more horizontal thanvertical. In the context of an installed element or device, “primarilyhorizontal” includes an element or device whose installed width isgreater than its installed height.

As used herein, “primarily vertical” means more vertical thanhorizontal. In the context of an installed element or device, “primarilyvertical” includes an element or device whose installed height isgreater than its installed width. In the context of a hard disk drive,“primarily vertical” includes a hard disk drive that is installed suchthat the installed height of the hard disk drive is greater than theinstalled width of the hard disk drive.

As used herein, a “rack” means a rack, container, frame, or otherelement or combination of elements that can contain or physicallysupport one or more computer systems.

As used herein, “room” means a room or a space of a building. As usedherein, “computer room” means a room of a building in which computersystems, such as rack-mounted servers, are operated.

As used herein, a “space” means a space, area or volume.

As used herein, “shelf” means any element or combination of elements onwhich an object can be rested. A shelf may include, for example, aplate, a sheet, a tray, a disc, a block, a grid, or a box. A shelf maybe rectangular, square, round, or another shape. In some embodiments, ashelf may be one or more rails.

As used herein, “shock absorbing”, as applied to a supporting elementfor another element, means that the supporting element absorbsmechanical energy and/or dampens shock and/or vibration loads. Ashock-absorbing material may be elastic, viscoelastic, viscous, orcombinations thereof.

In various embodiments, a data storage system includes one or more datastorage modules that are accessed from, and controlled by, a datacontroller external to the data storage modules. In some embodiments, adata control module and one or more data storage modules coupled to thedata control module are included within a rack. FIG. 1 is a blockdiagram illustrating one embodiment of a system including a data controlmodule and data storage modules in a rack. System 100 includes rack 102,data control module 104, data storage modules 106. Data control module104 and data storage modules 106 are included in rack 102.

Mass storage devices in data storage modules 106 are coupled to datacontrol module 104. Data control module 104 may access data on any orall of the mass storage devices in data storage modules 106 a, 106 b,and 106 c.

In various embodiments, a data storage module includes two or morecircuit boards, each of which carry, and provide electrical connectionsfor, multiple mass storage devices. For example, in the embodimentillustrated in FIG. 1, data storage module 106 includes backplanecircuit boards 108. Backplanes circuit boards 108 carry mass storagedevices 110. Backplane circuit boards 108 may provide power, data, andsignal connections for mass storage devices 110. In various embodiments,each of mass storage devices 110 is a hard disk drive. In oneembodiment, each of mass storage devices 110 is a 500 GB hard disk drivewith a SATA 3 Gb/s interface.

In the embodiment shown in FIG. 1, each backplane circuit board 108carries 16 mass storage devices 110. A backplane may, however, carry anynumber of mass storage devices. In some embodiments, differentbackplanes within a data storage module carry a different number of massstorage devices.

System 100 includes bus 112 a, 112 b, and 112 c. Bus 112 a couples datacontrol module 104 with data storage module 106 a. Bus 112 b couplesdata control module 104 with data storage module 106 b. Bus 112 ccouples data control module 104 with data storage module 106 c. Buses112 a, 112 b, and 112 c may each include one or more cables between datacontrol module 104 and data storage modules 106 a, 106 b, and 106 c.Each of buses 112 a, 112 b, and 112 c may provide a connection for datainput/output between data controller 104 and one of the data storagemodules. In some embodiments, each of buses 112 a, 112 b, and 112 c mayprovide for data I/O on multiple channels (for example, four channels).Each of data storage modules 106 a, 106 b, and 106 c may be assigned aseparate identifier.

In various embodiments, data access and transfer between a datacontroller and data storage modules in a system may be carried out byway of any suitable computer bus. In some embodiments, data access andtransfer is carried out by way of a Serial attached SCSI (SAS) bus. Insome embodiments, data access and transfer is carried out by way of aSerial Advance Technology Attachment (SATA) bus.

Connections within each of storage modules 106 a, 106 b, and 106 c mayinclude chaining backplanes within a data storage module. For example,as illustrated in FIG. 1, the left-most backplane is coupled to bus 112a by way of input 114 on backplane circuit board 108. Output 116 on theleft-most backplane is coupled to input 114 on the adjacent backplane.Each additional backplane circuit board 108 may be chained to anotherbackplane circuit board in a similar manner, such as is illustrated inFIG. 1.

In some embodiments, each of backplanes 108 includes an expander chip.The expander chip may enable communication with the various mass storagedevices 110. Each of backplanes 108 may also include a cascading portfor chaining backplanes 108 one to another. In some embodiments,backplanes 108 includes circuitry for conditioning power to mass storagedevices 110. In certain embodiments, backplanes 108 may each include apower supply for mass storage devices 110 on the backplane.

For the sake of clarity, the backplanes and mass storage devices areshown only for data storage module 106 a. The backplanes and massstorage devices for data storage modules 112 b and 112 c may be similarto those of data storage module 112 a.

Each backplane may include an output for each of the installed massstorage devices 110. In one embodiment, the data input/output interfaceto backplanes includes four channels. In one embodiment, each of massstorage devices 110 has a 500 GB storage capacity.

Although 3 modules are shown in FIG. 1, in various embodiments anynumber of data storage modules may be coupled to a data controller.

FIG. 2 illustrates one embodiment of a system including a data controlmodule and data storage module having mass storage devices installed onmultiple backplanes. System 120 includes data storage module 122 anddata control module 124. In some embodiments, data storage module 122and data control module 124 are mounted in a rack.

Data storage module 122 includes data storage module chassis 126, datastorage assemblies 128, power supply unit 130. Data storage assemblies128 include backplane circuit board assemblies 132 and hard disk drives134. Backplane circuit board assemblies 132 may be mounted horizontallyin data storage module chassis 126. Hard disk drives 134 are installedon backplane circuit board assemblies 132. Hard disk drives 134 may beinstalled in a vertical orientation. In some embodiments, hard diskdrives 134 are installed such that the installed height is the largestdimension of the hard disk drive.

Power supply unit 130 may be coupled to backplane circuit boardassemblies 132. Power supply unit 130 may supply power to backplanecircuit board assemblies 132 and hard disk drives 134.

Data control module 124 includes data control module chassis 140,control circuit board assemblies 142, and power supply unit 144. Controlcircuit board assemblies 142 and power supply unit 144 may be mounted ondata control module chassis 140. Control circuit board assemblies 142may access data on hard disk drives 134.

Power supply unit 144 may be coupled to control circuit board assemblies142. Power supply unit 144 may supply power to control circuit boardassemblies 142.

In one embodiment, data storage module 122 is about 4 U in height anddata control module 124 is about 1 U in height.

In FIG. 2, data storage module chassis 126 and data control modulechassis 140 are represented with a simple box outlines for the sake ofclarity. In various embodiments, a chassis for a module may include, orbe used in combination with, various structural elements and componentsfor support, mounting, and environmental protection of the elements ofthe module, such as enclosures, mounting plates, covers, panels, ormounting rails.

In various embodiments, a computing unit includes a power supply thatconforms to an industry-recognized standard. In some embodiments, apower supply for a computing unit has a form factor in accordance withan industry-recognized standard. In one embodiment, power supply units130 and 144 have a standard 1 U form factor. Examples of other standardsfor a power supply and/or a power supply form factor include 2 U, 3 U,SFX, ATX, NLX, LPX, or WTX.

In the embodiment shown in FIG. 2, data storage module 122 and datacontrol module 124 each include one power supply unit and data storagemodule data storage module 122 includes 96 hard disk drives. A computersystem may, however, have any number of hard disk drives, power supplyunits, or other components. In certain embodiments, a data storagemodule or data control module may have one or more internal fans topromote the flow of air through a computer system. For example, incertain embodiments, a row of fans may be provided along the rear edgeof data storage module 124. In certain embodiments, a computing unit mayhave no fans and/or no disk drives. In certain embodiments, a powersupply may be external to the storage or computing module. For example,in certain embodiments, control circuit board assemblies 142 of datacontrol module 124 may receive power from a power supply external todata control module chassis 140 (such as a rack-level power supply), andpower supply unit 144 may be omitted.

In some embodiments, a rack includes two or more data storage subsystemshaving vertically oriented hard disk drives. FIG. 3 is a schematicdiagram illustrating a front view of three data storage subsystems in arack. System 160 includes rack 162 and data storage sub-systems 164.Data storage subsystems 164 each include data control module 166 andthree data storage modules 168. In each of data storage subsystems 164,data control module 166 may control, and access data on, data storagemodules 168.

In some embodiments, data storage modules 166 include two or morehorizontally mounted backplanes carrying vertically oriented hard diskdrives. For example, data storage modules 168 may each include 6backplanes and hard disk drives arranged as described above for datastorage module 122.

In one embodiment, each of data storage modules 168 is 4 U in height andeach data control module 166 is 1 U in height, for a total of 13 U ofheight for each sub-system, and a total of 39 U used for the rack.Nevertheless, in various embodiments, data storage modules and datacontrol modules may be any suitable height.

Although in the embodiment shown in FIG. 1, the data controller is shownin the rack, a data controller may be located in any suitable location.

In some embodiments, backplanes are mounted to reduce or minimizetransmission of shock and/or vibration loads between each hard diskdrive and a chassis and between hard disk drives within a module. FIG. 4illustrates one embodiment of disk drive backplanes mounted on pads in achassis. Pads 180 are provided on rails 182 on the bottom of datastorage module chassis 126. Backplane circuit board assemblies 132 aremounted on pads 180. Pads 180 may be made of a shock absorbing material,such as an elastomeric material. Pads 180 may reduce transmission ofshock and/or vibration between data storage module chassis 126 and harddisk drives 134.

In some embodiments, elements of disk drive backplanes and a chassis maycombine to form a box section mounting for hard disk drives. Forexample, chassis bottom panel 184, rails 186, and one or more ofbackplane circuit board assemblies 132 may combine to form a rectangularbox section. The box section may reduce deformation of a chassis, suchas sagging of chassis bottom panel 184, which might occur if hard diskdrives 134 were installed directly on bottom panel 184 of data storagemodule chassis 126. In some embodiments, rails, pads, a tray, or similarstructural elements may serve multiple functions, including forming thebox section structure, space for cable runs, and space for air flow.

In some embodiments, a system includes an air passage under two or moremass storage device backplanes. FIG. 5 illustrates a data storage modulethat includes risers. Backplane circuit boards 132 may be mounted onbackplane circuit board 132. Risers 198 may space backplane circuitboards 132 from the floor of chassis to form gap 200. Gap 200 may defineair passage 202 under backplane circuit board assemblies 132. Airpassage 202 may extend continuously from the foremost backplane circuitboards 108 to the rearmost of backplane circuit board assemblies 132.

As shown in FIG. 2, air may flow in through front vents 204 in the frontof data storage module chassis 126. In the embodiments shown in FIG. 2,front vents 204 are located near the bottom of data storage modulechassis 204. Front vents may, however, be in any location on the frontof a chassis or enclosure. Air may be moved from front to rear of datastorage module chassis 126 by one or more air moving devices. The airmoving devices may be located external to data storage module chassis126, in or on data storage module chassis 126, or both. Air may flowthrough air passage 202 under backplane circuit board assemblies 132 andexit through the rear of data storage module chassis 126.

Still referring to FIG. 2, data storage module 122 may include powersupply inlet plenum 208 and power supply exit plenum 210. Some of theair at the front of data storage module chassis 126 may pass into powersupply inlet plenum 208 through power supply front inlet 212 and into ahousing for power supply unit 130. Air flowing through the power supplyhousing may exit the housing and pass into power supply exit plenum 210.In certain embodiments, air may be ducted to the bottom of the chassis(for example, under backplane circuit boards 132.

In some embodiments, air from power supply exit plenum may mix with aircoming into data storage module chassis 126 before passing underbackplane circuit boards 132. In certain embodiments, exhaust air frompower supply unit 144 may be segregated from other air entering datastorage module chassis 130, for example, by a duct that carries theexhaust air from the power supply unit to the rear of data storagemodule chassis 126.

In certain embodiments, a power supply is oriented in a module such thatthe exhaust air from the module is directed under mass storagebackplanes in a chassis. For example, power supply unit 130 shown inFIG. 2 may be rotated 90 degrees counterclockwise such that air flowingthrough the power supply unit exits the power supply unit near thebottom of the chassis.

In some embodiments, air flowing under mass storage device backplanesmay be vented upwardly so as to remove heat from the mass storagedevices. For example, as shown in FIG. 5, air flow may be vented fromunder mass storage device backplanes. Air may flow under backplanecircuit board assemblies 132 in air passage 202 between the backplanesand the bottom of data storage module chassis 126. At each of backplanecircuit boards 132, some of the air flowing from the front to the rearof the chassis may be vented through openings 216 in backplanes circuitboard assemblies 132 between hard disk drives 134. Air may rise throughopenings 216 upwardly across the surfaces of hard disk drive 134. Someof the air may reach the top of the chassis. The air passing upwardlyover hard disk drives 134 may remove heat from hard disk drives 134. Airpassing upwardly across hard disk drives 134 may move toward the rear ofdata storage chassis 126.

In some embodiments, the size and number of opening in a backplane maybe selected to tune the air flow through various hard disk drives in achassis. For example, in one embodiment, the vents for the backplanesnear the rear of the chassis may larger than the vents for thebackplanes near the front of the chassis, since a greater airflow may berequired near the rear of the chassis because of the relatively warm airin that portion of the chassis.

FIG. 6 illustrates one embodiment of a data storage module including ashelf and cross braces for hard disk drives with hard disk drivesinstalled on the shelf. Data storage module 220 includes chassisassembly 222, power supply unit 224, and hard disk drives 226. Chassisassembly 222 includes base panel 228, front housing 230, shelf 232,cross braces 234, and left side panel 236. Chassis assembly 222 may alsoinclude a right side panel (a right-side panel has been omitted fromFIG. 6 for illustrative purposes).

In the embodiment shown in FIG. 6, Cross braces 234 are provided betweeneach of backplane circuit board assemblies 234. In other embodiments,however, cross braces may be provided between only certain rows of harddisk drives, or omitted altogether.

In some embodiments, shelf 232 is mounted on shock absorbing elements.For example, an array of shock absorbing pads may be provided betweenshelf 232 and base panel 228.

Cross braces 234 are mounted on shelf 232. Hard disk drives 226 areinstalled on backplane circuit board assemblies 225 between cross braces234.

In the embodiment shown in FIG. 6, power supply unit 224 is mounted suchthat its length runs transversely relative to the front of the chassis(for example, lengthwise left to right). Opening 244 is provided at thefront of chassis assembly 222. Opening 244 may allow air at the front ofdata storage module 220 to pass into air passage 245 formed between basepanel 228 and shelf 232. Air passage 245 may run the length of datastorage module 220 from front to back. Air passage 245 may supply airfor removing heat from hard disk drives 226.

FIG. 7 illustrates one embodiment of a data storage module including ashelf and cross braces for hard disk drives with hard disk drivesremoved for illustrative purposes. In addition, rear-facing members ofthe cross braces have been omitted for clarity. In some embodiments,rear-facing cross brace members are identical to the front-facing crossbrace members.

Cross braces 234 include guide rims 249. Guide rims 249 include openings246. Cross braces 234 may stiffen chassis assembly 222 and inhibitsagging of chassis elements under the weight of hard disk drives 226.Guide rims 249 may serve as guides for hard disk drives 226. Openings246 may provide a path for front-to-back air flow through cross braces234 between adjacent hard disk drives 226.

FIG. 8 is a top perspective view of one embodiment of a disk storageassembly including a backplane circuit board. FIG. 9 is a bottomperspective view of one embodiment of a disk storage assembly includinga backplane circuit board. Disk storage assembly 250 includes hard diskdrives 226 and backplane circuit board assembly 225. Hard disk drives226 may mount on backplane circuit board assembly 225 at base 251.Connectors 252 may electrically couple hard disk drives 226 to backplanecircuit board assembly 225.

Each of hard disk drives 226 may be provided with a pair of opposingrails 254. In some embodiments, rails 254 may serve as a handle for harddisk drives 226.

Backplane circuit board assembly 225 may include tabs 255 and mountingpads 256. In some embodiments, mounting pads 256 are made of ashock-absorbing material. In certain embodiments, mounting pads 256include threads (for example, for installing a backplane on a chassis).Tabs 260 may engage in slot 247 on cross brace 234.

FIG. 10 is illustrates one embodiment of an installation of hard diskdrives in a data storage module. Tabs 255 on backplane circuit boardassembly 225 may extend into corresponding slots in cross brace 234.Pads 256 may be installed in sockets 262 of shelf 232.

Rails 254 of hard disk drives 226 may slide in between the edges ofadjacent rims 249. Hard disk drives 226 may slide in and out from thetop of the chassis. In some embodiments, rails 254 provide shock orvibration isolation for the hard disk drives. In certain embodiments,for example, rails 254 are made of, or include, an elastomeric material,such as rubber. The rail may dampen shock or vibration loads and/orisolate a particular drive from vibration in other drive, on thebackplane, or external to the backplane.

Referring again to FIG. 7, during operation, air at the front of datastorage module 250 may flow into power supply opening 240 and opening244. Air entering through power supply opening 240 may pass through anenclosure for power supply unit 224. The air may exit the power supplyenclosure through vent 242. Air exhausted from vent 242 of power supplyunit 224 may mix with air entering chassis assembly 224 through opening244. The mixed air may continue through air passage 245. Some of the airmoving from front to rear in air passage 245 may pass through shelfvents 238 in shelf 332 and through backplane openings 259 (shown in FIG.9). Air that has been vented through shelf vents 238 may flow upwardlyacross hard disk drives 226 and rearward through openings 246 in crossbraces 234, thereby removing heat from hard disk drives 226. Air mayflow through openings 246 in cross braces 234 until it reaches the rearof chassis assembly 222.

In some embodiments, a data storage module includes a data controllerand two or more backplanes having multiple mass storage devices. Thedata controller and the backplanes may be supported on a common chassis.In some embodiments, the module includes hard disk drives mounted on thebackplanes in a vertical orientation. FIG. 11 illustrates one embodimentof a module that includes a data controller and multiple disk drivebackplanes. Data storage module 280 includes controller 282, datastorage assemblies 284, power supply units 286, and chassis 288.Controller 282, data storage assemblies 284, and power supply units 286are mounted on chassis 288.

Data storage assemblies 284 include backplane circuit board assemblies290 and hard disk drives 292. Backplane circuit board assemblies 290 maybe mounted horizontally in data storage module chassis 288. Hard diskdrives 292 are installed on backplane circuit board assemblies 290. Harddisk drives 292 are installed in a vertical orientation, similar to thatdescribed above relative to FIG. 2. Each of backplane circuit boardassemblies may carry, and provide electrical connections for, multiplehard disk drives 232.

Power supply units 286 may be coupled to backplane circuit boardassemblies 290. Power supply units 286 may supply power to backplanecircuit board assemblies 290 and hard disk drives 292.

In some embodiments, air flows from front to rear in a module such thatair downstream from a controller or motherboard assembly flows under twoor more mass data storage backplanes. For example, as shown by thearrows in FIG. 11, air may pass into front vents 294 of chassis 288 andover controller 282. Air downstream from controller 282 may flow underbackplane circuit board assemblies 290. In some embodiments, airexhausted from power supply units 286 mixes with air downstream fromcontroller 282 before passing under backplane circuit board assemblies290.

FIG. 12 illustrates one embodiment of removal of heat from data storagemodules in a rack system. Air may pass into computing room 352 fromsub-floor plenum 354 by way of vent 380. Rear fans 366 in fan door 374may draw air from front aisle 368 into rack 364, and through datastorage modules 360 and data control modules 362. Rear fans 366 mayexhaust heated air out of the rack. The heated air may pass into ceilingplenum 356. Air directing device 389 is provided on the front or rack.Air directing device 389 may be used to promote airflow in particularmodules mounted in the rack. Other arrangements of air movers may beincluded in various embodiments. U.S. patent application Ser. No.12/646,417, “Air Directing Device for Rack System”, filed Dec. 23, 2009;U.S. patent Ser. No. 12/751,212, “Rack-Mounted Air Directing Device withScoop”, filed Mar. 30, 2010; and U.S. patent application Ser. No.12/886,440, “System with Rack-Mounted AC Fans”, filed Sep. 9, 2010, eachof which is incorporated by reference as if fully set forth herein,include other arrangements, systems, devices, and techniques that may beused in various embodiments for cooling or mounting computing modules,data storage modules and data control modules.

In some embodiments, mass data storage is provided on multiplebackplanes in a common chassis. FIG. 13 illustrates a method ofproviding data storage that includes providing mass storage devices ontwo or more backplanes coupled to a common chassis. At 400, two or moremass storage backplanes are mounted on a common chassis. The massstorage devices may be, for example, hard disk drives. The backplanesmay be in horizontal orientation on the chassis. The hard disk drivesmay be in a vertical orientation. In one embodiment, data storage andcontrol are provided in a data storage module and data control modulesimilar to those described above relative to FIG. 2. In certainembodiments, the backplanes are coupled to one another and at least oneof the backplanes is coupled to a data controller. The data controllermay be external to the chassis in which the backplanes are mounted.

At 402, some or all of the mass storage devices on the backplanes may beplaced into operation. For example, the mass storage devices may providestorage capacity in a data center.

At 404, some or all of the mass storage devices on the backplanes may bepowered down or placed on standby. The powered down or standby massstorage devices may be considered to be in a cold storage state. At 406,one or more of the mass storage devices that are powered down or onstandby are awakened. At 408, data from the mass storage devices thathave been awakened is accessed.

Upon failure of a hard disk drive in a module, the module may be removedor withdrawn from its installed position in a rack. The failed hard diskdrive may be removed and replaced by way of the top of the module.

In certain embodiments, a computing module includes mass storage devicesthat are mounted in two or more different orientations. In oneembodiment, a computing unit includes one or more hard disk drivesmounted in a horizontal orientation and one or more hard disk drivesmounted in a vertical orientation.

In some embodiments, hard disk drives in a data storage module arestandard, off-the-shelf disk drives. Examples of suitable hard diskdrive form factors may include 3.5″, 5.25″, and 2.5″. In one embodiment,a standard 3.5″ hard disk drive is installed such that the installedheight of the hard disk drive is the largest dimension.

In some embodiments, rack-mounted computing modules are commonly cooledby a cooling air system that delivers air to the rack. To remove heatfrom computing modules installed in the rack, an air handling system maybe operated to cause air to flow in computer room and through the racksystem. As the air reaches the front of each of computing modules, theair may pass through the chassis of the computing modules. After passingthrough the chassis, the heated air may exit the rear of the rack systemand flow out of the computer room. In certain embodiments, computingmodules may have on board fans in addition to, or lieu of, a centralcooling system. In certain embodiments, a rack may have a fan thatsupplies cooling air to all of the computing modules in the rack.

Although in the embodiments described above, the hard disk drives aremounted on pads and rails, in various embodiments, hard disk drives orother data storage devices may be mounted to a chassis using othermounting elements. For example, hard disk drives and/or backplanes forthe disk drives may be mounted on square tubes that support the drivesand raise the drives above the bottom of a chassis.

In some embodiments, a rack system includes rack-mounted fans externalto computer systems in the rack. The rack-mounted fans may provide airflow through the computer systems.

For clarity, modules in many of the figures herein have been shown witha simple box outline around functional components. In variousembodiments, a module or a chassis for a module may include anenclosure, a tray, a mounting plate, a combination thereof, as well asvarious other structural elements.

Although in the embodiments described above, some of the data storagemodules have been described as being 4 U in height, modules may invarious embodiments be 3 U, 4 U, 6 U or any other height or dimensions.

Although the embodiments above have been described in considerabledetail, numerous variations and modifications will become apparent tothose skilled in the art once the above disclosure is fully appreciated.It is intended that the following claims be interpreted to embrace allsuch variations and modifications.

What is claimed is:
 1. An apparatus comprising: a chassis; and a powersupply unit mounted in the chassis and configured to supply electricalpower to electronic components mounted in the chassis, wherein a lengthof the power supply unit runs transverse to a front of the chassis, andwherein an airflow through the power supply flows in a directiontransverse to an airflow through the chassis.
 2. The apparatus of claim1, wherein the power supply further comprises: an inlet plenum at afirst end of the length of the power supply configured to direct airflowing perpendicular to the length of the power supply into a housingof the power supply; and an exit plenum at a second end of the length ofthe power supply configured to direct air exiting from the housing ofthe power supply into the airflow through the chassis.
 3. The apparatusof claim 2, wherein the inlet plenum is located at a first end of thepower supply on a front of the power supply and wherein the exit plenumis located at a second end of the power supply on a back of the powersupply.
 4. The apparatus of claim 2, wherein the inlet plenum is locatedat a top end of the power supply on a front of the power supply andwherein the exit plenum is located on a bottom end of the power supplyon a back of the power supply.
 5. The apparatus of claim 4, furthercomprising an air passage under a backplane mounted in the chassis,wherein the exit plenum is positioned in the chassis such that air thathas passed through the power supply is directed into the air passageunder the backplane mounted in the chassis.
 6. The apparatus of claim 1,further comprising an air passage under a backplane mounted in thechassis, wherein an airflow through the air passage bypasses the airflow through the power supply.
 7. The apparatus of claim 6, furthercomprising: an opening in the chassis for air entering the air passagethat is separate from an opening for air entering the power supply unit.8. The apparatus of claim 7, wherein the backplane further comprises:openings configured to allow air to flow through the backplane to removeheat from electronic components coupled to the backplane.
 9. Theapparatus of claim 1, wherein the chassis further comprises; a firstside panel; a second side panel; and cross-braces coupled between thefirst side panel and the second side panel, wherein the cross-bracescomprise openings configured to provide a path for an airflow throughthe chassis to flow through the cross-braces.
 10. A method, comprising:flowing air through a power supply transversely mounted in a chassis,wherein the power supply is configured to supply electrical power toelectronic components mounted in the chassis; and flowing air that haspassed through the power supply through a portion of the chassisdownstream of the power supply to cool the electronic components mountedin the chassis, wherein the air flowing through the power supply flowsin a direction transverse to the air flowing through the portion of thechassis downstream of the power supply.
 11. The method of claim 10,wherein the air, while flowing through the power supply, flows in adirection transverse to a length of the chassis and wherein the air,while flowing through the chassis, flows in a non-transverse directionalong the length of the chassis.
 12. The method of claim 10, wherein thepower supply comprises: an inlet plenum at a first end of a length ofthe power supply, wherein the inlet plenum is configured to direct airflowing perpendicular to the length of the power supply into a housingof the power supply; and an exit plenum at a second end of the length ofthe power supply, wherein the exit plenum is configured to direct airexiting from the housing of the power supply into an airflow through thechassis.
 13. The method of claim 10, further comprising: flowing airthrough an air passage in the chassis such that the air flowing throughthe air passage bypasses the air flowing through the power supply. 14.The method of claim 13, wherein the air passage extends along a lengthof the chassis above or below the power supply.
 15. The method of claim14, wherein the air flowing through the power supply enters the powersupply via an opening located at a first end of the power supply on afront of the power supply and wherein the air that has passed throughthe power supply flows out of the power supply via an opening located ata second end of the power supply on a back of the power supply.
 16. Themethod of claim 10, wherein the air flowing through the power supplyenters the power supply via an opening located on a top end of a frontside of the power supply and wherein the air that has passed through thepower supply flows out of the power supply via an opening located at abottom end of a back side of the power supply.
 17. The method of claim16, further comprising: directing the air flowing out of the powersupply into an air passage under a backplane mounted in the chassis. 18.A method of providing data storage, comprising: providing a plurality ofmass storage devices on two or more backplanes coupled to a commonchassis; providing a power supply unit in the common chassis, whereinthe power supply unit is configured to supply electrical power to theplurality of mass storage device on the two or more backplanes, andwherein a length of the power supply unit runs transverse to a front ofthe common chassis; powering down in place on at least one of thebackplanes or placing on standby one or more of the mass storagedevices, such that another one of the mass storage devices remainsawakened; in response to a determination that data on one of the massstorage devices that is powered down or on standby needs to be accessed,waking up the one of the mass storage devices that is powered down inplace or on standby, such that two or more mass storage devices areawakened; and accessing data on at least one of the awakened massstorage devices.
 19. The method of claim 18, further comprisingelectrically coupling at least two of the backplanes coupled to thechassis to one another, the method further comprising electricallycoupling at least one of the backplanes to an external data controller.20. The method of claim 18, further comprising moving air under at leastone of the backplanes to remove heat from at least one of the massstorage devices on the at least one backplane.